Latest about Tech Industry
Analysts halve Nvidia Blackwell cabinet shipment forecasts for 2025
Industry analysts have slashed their 2025 GB200 NVL72 shipment projections by 50%, but the industry expects an explosion of AI hardware shipments.
GlobalFoundries to expand New York fab — announces new $575 million advanced packaging and photonics facility
GlobalFoundries is investing around $575 million to construct an advanced packaging and silicon photonics facility at its Malta, New York site.
Bureaucracy and distance means TSMC's U.S. fabs may always be behind Taiwan
TSMC says it is close to impossible to ramp up a leading-edge node in the U.S. and bureaucracy and distance are to blame
PCIe standards group releases draft specification for PCIe 7.0
PCI-SIG just released PCIe 7.0 specifications draft version 0.7, and it expects to finalize the standard this year.
Apple joins UALink Consortium for open-standard AI accelerator interconnections
Apple could be finally entering AI hardware game as it joins UALink development.
TSMC's Arizona fab produces 4nm chips at a higher price than Taiwan
TSMC confirms Arizona Fab 21 is making chips in volume, charges higher prices than Taiwanese fabs.
China investigates whether CHIPS and Science Act harms its chip companies
The Chinese Ministry of Commerce alleges that U.S. subsidies to semiconductor industry harm government-funded Chinese chipmakers.
Nvidia shifts to CoWoS-L packaging for Blackwell production ramp-up
As demand shifts for dual-die Blackwell products, Nvidia reportedly increases CoWoS-L orders while possibly reducing orders for CoWoS-S packaging technology.
