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Russia plans EUV chipmaking tools that it says will be cheaper and easier to build than ASML's
By Anton Shilov published
Russia to develop lithography systems that could compete against ASML's Twinscan NXE EUV systems.
GlobalWafers inks $406 million CHIPS Act deal to make 300mm wafers in the U.S.
By Anton Shilov published
U.S. government and GlobalWafers finalize $406 million deal to build 300mm wafer production facility in Missouri
China developing critical chipmaking supply chains — photoresist ecosystem emerges for ArF and KrF lasers
By Anton Shilov published
Chinese photoresists are getting better, could eventually address advanced process technologies.
China kicks off homegrown Bluetooth alternative
By Kunal Khullar published
Due to its integration into universal remote controls, Star Flash is set to become a common feature in many Chinese households
Elon Musk prioritizing humanoid robot advances, says TSMC CEO
By Mark Tyson published
Elon Musk is now prioritizing advances in humanoid robotics, indicates TSMC’s CC Wei.
Russia using homegrown Raspberry Pi-like computers in nuclear facilities
By Anton Shilov published
Russia includes programmable controllers based on dual-core Elbrus 2C3 proccors into a list of hardware that can be used at critical information infrastructure facilities.
Nvidia's new $249 AI development board promises 67 TOPS at half the price of the previous 40 TOPS model
By Avram Piltch published
The Jetson Orin Nano Super Developer Kit will be available later this month and comes with 8GB of RAM.
Pricing for key chipmaking material hits 13-year high following Chinese export restrictions
By Kunal Khullar published
China's dominance and its latest export restrictions to the U.S. have led to a sharp increase in the prices of gallium.
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