The migration from plastic ball-grid array (PBGA) to flip-chip (FC) packaging for northbridge chips will not proceed much further this year, as VIA Technologies, ATI Technologies and Nvidia will continue using PBGA packaging for their solutions, according to industry sources.
Sources at VIA indicated that the company has decided to continue using PBGA-packaged northbridge chips this year, as the price difference between FC and PBGA packaging remains significant.
More here at DigiTimes.
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