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SK hynix could get nearly $1 billion to support $3.87 billion advanced packaging facility in the U.S.
By Anton Shilov published
SK hynix to get massive support from U.S. government to assemble HBM4 in the U.S.
Chinese companies are stockpiling HBM2E chips ahead of new U.S. export rules
By Anton Shilov published
Baidu, Huawei, and Tencent are stockpiling Samsung's HBM2E memory to use with their own AI processors.
Samsung mass produces 'world's thinnest' LPDDR5X
By Anton Shilov published
Samsung's new LPDDR5X uses 12nm technology to free up space in mobile devices.
JEDEC's new standards will double DDR5 bandwidth, enable faster memory for laptops
By Jowi Morales published
JEDEC plans to introduce multiplexed memory to double the bandwidth of current DDR5 RDIMMs on servers and data centers. It's also working on adding LPDDR6 to CAMM2 for laptops.
Gigabyte has to twist its RAM slots to fit 48 DDR5 sticks into a standard server
By Dallin Grimm published
Gigabyte's R283-ZK0 motherboard fits two AMD SP5 server sockets on one board, and has to twist the onboard DDR5 memory slots to fit 48 DIMMs for 2 DIMM per channel operation.
Buckle up! Apacer launches seat belt for RAM sticks
By Dallin Grimm published
“Buckle up for safety” includes computer components
G.Skill Trident Z5 RGB DDR5-6400 C32 2x48GB Review: Soulmate For Dual-DIMM Motherboards
By Zhiye Liu published
G.Skill launched a DDR5-6400 C32 96GB memory kit for prosumers, but can it hang with the higher-clocked competition?
TeamGroup T-Force Vulcan Eco DDR5-6000 C30 2x16GB Review: Eco-Friendly DDR5 Performance
By Zhiye Liu published
TeamGroup's Vulcan Eco lineup brings innovation to the table, but is it sufficient to rival the modern competition?
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