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Micron puts stackable 24GB HBM3E chips into volume production
By Matthew Connatser published
Micron's HBM3E is coming into volume production, bringing the stackable 24GB chips capable of 1.2TB/s to the world.
MSI brings 256GB RAM support on Intel and AMD motherboards
By Zhiye Liu published
MSI deploys new firmware for Intel 700- and 600-series motherboards to support up to 256GB of memory.
Crucial takes aim for the sweet spot with DDR5 Pro Memory Overclocking Edition running at DDR5-6000
By Zhiye Liu published
Crucial expands its DDR5 portfolio with the Pro Memory: Overclocking Edition up to DDR5-6000.
TSMC and SK Hynix team up for HBM4 co-production: Report
By Anton Shilov published
TSMC and SK Hynix reportedly join forces to build products for AI, including HBM4 memory.
China's CXMT reportedly aims to make HBM memory for AI chips
By Anton Shilov published
CXMT to compete against Micron, Samsung, and SK Hynix for lucrative HBM memory market, says report.
Samsung opens next-gen 3D DRAM research lab in the United States
By Christopher Harper published
Samsung opens a new, Silicon Valley-based research lab for developing the next generation of 3D DRAM.
Rising memory prices and AI demand gives SK Hynix its first profit since Q3 2022
By Anton Shilov published
Sales of DDR5, HBM3, and LPDDR helped SK Hynix to boost sales and narrow losses.
Chinese DRAM maker CXMT 18.5nm node allegedly complies with U.S. export rules
By Anton Shilov published
Chinese maker of DRAM renames its 17nm process technology to 18.5nm, claims it fell short of standard, to comply with U.S. export rules and get advanced fab tools.
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