TSMC kicks off unprecedented capacity expansion plan.

We explore Globalfoundries, UMC, and SMIC's individual trailing-edge roadmaps, as each company is pursuing a fundamentally different strategy shaped by geography, regulation, and technology choices.

2nm is here, so what's next?

As data center demand surges toward zettabyte scale, Seagate, Toshiba, and Western Digital are pursuing sharply different technology strategies in their pursuit towards 100TB and beyond.

ASML shipped 48 EUV lithography systems and 131 immersion DUV tools in 2025, generating €32.7 billion in total revenue and ending the year with a €38.8 billion order backlog.

TSMC adds support for face-to-face stacking, 6.5 µm and 4.5 µm pitches for the next generation of SoIC 3D stacking.

TSMC claims that CoWoS innovations will enable 48x more compute and 34x more memory bandwidth for 2029 AI processors.

We analyze the approaches of PsiQuantum and Xanadu, who are each developing their own approaches to quantum photonic communications, with a vision that extends beyond 2029.

As time changes, so does technology.