TSMC's second 2nm fab could be ready earlier than expected — the company could deploy two leading-edge fabs at once

TSMC
(Image credit: TSMC)

TSMC's second fab capable of processing wafers using the company's N2 process technology (2nm-class) could be ready in Kaohsiung Science Park somewhat ahead of schedule, reports China Times. However, this news should be taken with a grain of salt, as it hasn't been confirmed by TSMC. Also, the foundry has reportedly obtained all the necessary permissions to construct another fab in Kaohsiung Science Park.

The report from China Times also claims that phase 1 of TSMC's N2-capable fab near Kaohsiung aims to start mass production in 2025, which is a bit earlier than expected as typically the company does not deploy two leading-edge fabs at once. 

TSMC is prepping to build at least two N2-capable fabs in Taiwan. The first fabrication facility is set to be situated near Baoshan in Hsinchu County, adjacent to its R1 research and development center, which is focused on N2 technology development. As planned, this fab is set to start high-volume manufacturing (HVM) of 2nm chips in the second half of 2025. TSMC's second N2-capable fab is set to be located in the Kaohsiung Science Park, a segment of the Southern Taiwan Science Park near Kaohsiung. This fab is meant to start HVM a bit later, presumably in 2026. 

Anton Shilov
Contributing Writer

Anton Shilov is a contributing writer at Tom’s Hardware. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.