Detailed performance insights, technical breakdowns and long-form reporting from our hardware team.
-
-
PremiumChina's homegrown AI accelerators to supply 90% of the country's domestic market, analysts suggestChina could become almost self-sufficient in high-end AI accelerators in 2026 as Chinese IHVs led by Huawei expected to supply 90% of AI processors used domestically.
-
PremiumAI data center optical interconnect market to hit $144 billion by 2030A new CIC forecast projects that the data center optical interconnect market will grow from $13.7 billion in 2024 to $144.4 billion by 2030, with silicon photonics accounting for 63.7% of revenue.
-
PremiumNear-packaged optics (NPO) gains ground as the industry hedges against CPO's growing painsSemiAnalysis calls NPO the interim step between pluggable transceivers and true CPO.
-
PremiumThe current state of PCIe 6.0 SSDs and controllersMicron and Samsung already have actual SSDs
-
PremiumFCC proposes import ban on Chinese optical transceiversThe FCC is drafting a proposal that would expand its list of equipment and services covered by the Secure Networks Act to include imports of new-model optical transceivers manufactured in China.
-
PremiumHyperscalers commit nearly $2 trillion to secure AI hardware and memoryAs hyperscalers increase their long-term purchase commitments, the high-tech industry faces a tectonic shift as CSPs overwhelm consumer electronics companies.
-
PremiumOver 70% of Americans oppose AI data centers; US protests intensify as more arrests are being madeThe public pushback against data center construction projects is only growing stronger, even as some protesting local residents have been arrested in the process.
-
PremiumAnthropic co-designing custom AI inference chips to bypass costly Nvidia GPUsIt joins Amazon, Meta, OpenAI, and Google with its new "multi-chip" strategy.
-
Free Premium ArticleSamsung debuts three next-generation memory technologies for AI data centersSamsung uses FMS to unveil three next-generation memory technologies — zHBM, zNAND-O, and BV-NAND — that target different markets, but all rely on advanced wafer-bonding techniques.
-
