Detailed performance insights, technical breakdowns and long-form reporting from our hardware team.
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PremiumThe AI tokenmaxxing party is crashing over spiraling costs"Leadership [...] are still asking the question of whether they're getting value from what we're spending."
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PremiumUS Secures Netherlands for Pax Silica Alliance in key win for strategic chip allianceInside the US Pax Silica Alliance with the Netherlands.
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PremiumArm servers capture over 45% of data center market revenueArm-based servers accounted for nearly half of server revenue in Q1 2026, challenging x86. But in the coming years, they might catch up unit wise as well.
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SemiconductorsPost-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough techImec, ASML, and TSMC have integrated both n-type and p-type transistors with atomically thin 2D channels on a single 300mm wafer.
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PREMIUMUS pulls the 'kill-switch' on Anthropic's Fable 5 AI models, sending global allies scramblingWorld leaders are concerned that projects can be cut off by arbitrary U.S. regulations.
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PremiumMarvell details vision of optically-interconnected data centers spanning across thousands of kilometresMarvell shares its vision for optically connected data centers, connecting devices across hundreds of kilometers, and the company already has hardware to build them.
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PremiumNvidia's high-speed AI data center storage servers break cover, touting 2.9 petabytes of storage and extreme PCIe 6.0 performanceWiwynn is among the first to demonstrate Nvidia SCADA server that promises to offer AI systems petabytes of ultra-fast storage thanks to GPU-accelerated storage acceleration.
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PremiumAI is set to consume up to 600 billion gallons of water by 2030As GPU power demands almost double with every generation, most water usage will come where the power is generated.
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PremiumGoogle reportedly books Intel for packaging more than 3 million TPUs in 2028Google has placed an order for Intel to build more than 3 million of its TPUs in 2028 after months of testing Intel's advanced packaging.
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