Latest about Manufacturing
U.S. outlines five-year plan to harness CHIPS Act funds
The National Science and Technology Council has published its five-year strategy to make the most of the CHIPS Act.
ASML delivers cutting-edge new chipmaking tool
ASML's Twinscan NXE:3800E speeds up wafer processing to up to 220 wafers per hour and can enable 2nm and thinner process nodes.
Chinese foundry XMC aims to produce HBM memory
Yangtze Memory may jump into the HBM memory business via its XMC foundry unit.
Samsung races to beat Intel to market with glass substrates for chips — revolutionary tech boosts processing capabilities
Intel forms strategic alliance to develop and commercialize usage of glass substrates.
Pentagon pulls out of Intel's $3.5 billion CHIPS Act grant, expects Commerce Department to foot the bill
The Pentagon pulled out of a plan to give Intel more CHIPS Act funding.
Malaysia's semiconductor manufacturing flourishes in the face of U.S. and China's Chip War
Malaysia's place in the Chip War as an alternative place to manufacture semiconductors and chips without drawing ire of US politicians and regulations.
Samsung rep says High-NA EUV is good for logic, but might have cost issues for memory fabrication
Samsung shares its views on High-NA EIV costs, while other companies present more bullish views.
Semiconductor group says China chipmaking sanctions should be the 'last resort,' cautions EU against further restrictions
SEMI Europe calls for clear and unified export control rules, international partnerships, simplified investments and ongoing dialog with European legislators.
