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Intel's Lunar Lake MX mobile processor pictured, with LPDDR5X memory on board
By Anton Shilov published
Another report claims that Intel's Lunar Lake-MX compute tile is made by TSMC using its N3B process technology.

SMIC and Huawei could use quadruple patterning for China-made 5nm chips: Report
By Anton Shilov published
Something that almost killed Intel is now patented in China. But it remains to be seen how viable it will be.

The world's semiconductor industry hinges on a single quartz factory in North Carolina
By Mark Tyson published
The deposits formed 380 million years ago when Africa collided with North America.

US chip toolmakers skip Semicon China conference they sponsored amid ongoing trade war
By Matthew Connatser published
Several of Semicon China's U.S.-based sponsors skipped the conference, as did companies like Micron and ASML.

SK hynix to spend $90 billion to build 'world's largest mega fab complex' — first fab operational in 2027
By Matthew Connatser published
Termed the Yongin Semiconductor Cluster, SK hynix's upcoming quadruple fab complex will be the largest in the world.

Ultra Ethernet Consortium adds 45 new members in five months – aiming for version 1.0 to connect HPC and AI clusters this year
By Anton Shilov published
45 additional members join the Ultra Ethernet Consortium to enable next-generation connectivity for AI and HPC applications.

Intel pushes launch date of Ohio fab from 2025 to 2027 or 2028
By Mark Tyson published
Intel reports that its Ohio fab won't be operational until 3 years later than originally reported.

U.S. outlines five-year plan to harness CHIPS Act funds
By Matthew Connatser published
The National Science and Technology Council has published its five-year strategy to make the most of the CHIPS Act.
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